Stages                                                    Dates 

Round Announcement

24 June 2026

Submission Window

24 June – 24 July 2026

Design Review

27 July – 14 August 2026

Fabrication

17 August – 18 September 2026

Delivery

End of September 2026

Confidentiality and IP Protection

All participation is conducted under NDA. Only the submitting team and the Foundry have access to a given design during review, integration, and fabrication. Wafer previews show only the participant’s own chips, and internal workflows ensure strict compartmentalization of design data.


Export Compliance

All devices under the Q-MPW program fall under EU Dual-Use Annex I, Category 3A001. An End-User Statement (EUS) is required for all destinations. Shipments outside the EU and EU001 countries (AU, CA, JP, NZ, NO, CH, UK, US) may require an individual export licence.

Quantum Multi-Project
Wafer (Q-MPW) Program

The ConScience Q‑MPW program provides shared access to our superconducting quantum fabrication line, offering a predictable, cost‑efficient path from layout to fabricated devices without committing to a full wafer run. Each round follows a fixed quarterly schedule, providing participants with reliable planning and consistent availability throughout the year.


Q‑MPW runs use ConScience’s qualified aluminium‑on‑silicon process, including a 300 nm ground plane on high‑resistivity silicon, Manhattan‑style Josephson junctions, and airbridge structures. The process has demonstrated compatibility with transmon qubits exhibiting coherence times up to 250 μs and coplanar waveguide resonators with internal quality factors approaching one million, as shown in our QiB0 product line. Typical Josephson junction resistance variation is ±20% globally and ±10% within a block.


Every MPW round follows the same structured sequence—from submission and design review to wafer integration, fabrication, and delivery—ensuring predictable timelines and a streamlined experience for participating teams.


Distinction from Full‑Wafer Foundry Services

The Q‑MPW program provides shared‑wafer access to our superconducting fabrication process and is intended for cost‑efficient prototyping, early‑stage device development, and academic research. Each participant contributes designs to a common wafer run, following the fixed quarterly schedule.


For customers requiring exclusive wafer ownership, custom process flexibility, or priority access with faster turnaround, ConScience offers a separate full‑wafer fabrication service through our Custom Qubits offering. This service provides dedicated wafer runs, full control over wafer layout, and accelerated scheduling.


The two services are distinct: Q-MPW maximizes accessibility and predictability through shared runs, while Quantum Foundry provides full‑wafer control and faster delivery for advanced development.


Design Participation

Participants may submit designs according to the following structure:

  • Up to two designs per round, each provided as a separate GDS file

  • Maximum chip size of 10×10 mm, using the standard Q‑MPW GDS template

  • Wafer structure: each wafer is divided into 20×30 mm blocks, each containing six 10×10 mm chip slots

  • Block allocation: participants receive blocks according to their tier and may place one or multiple designs within their allocation

  • Design‑rule check: all submissions undergo a full DRC review, with revision support when needed

Deliverables

Participants receive:


  • Fabricated chips corresponding to your design and their allocated Blocks on the wafer

  • Josephson junction resistance variation data


For technical details, pricing, or participation in an upcoming Q-MPW round, please complete the contact form below.

Contact Form:

 
 
 
 
 

Disclaimer

ConScience AB offers and sells custom nanofabrication services by request. ConScience AB makes no claim to copyrighted materials or methods externally provided and sells only services requested – which are tailored toward customer demands. ConScience AB performs custom nanofabrication within a wide spectrum of fields and therefore, cannot reasonably assess FTO upon every request. As such, ConScience AB operates in good faith with customers under the assumption that customers have rights to use all designs provided and requested. Upon entering into a contract with ConScience AB, the customer agrees to assume liability for the designs and methods provided.