News

Now launching at APS Global Physics Summit 2026:

ConScience’s Quantum Pilot Line - Quantum Multi-Project Wafer (Q-MPW) program provides shared access to our superconducting quantum fabrication line.https://t.co/VCbcVH29B9 pic.twitter.com/JARuEZYJMC

— ConScience (@ConScienceAB) March 16, 2026

We’re proud to announce that the first batch of flip-chip integrated quantum devices from our Quantum Foundry service has been successfully delivered.

What is flip-chip packaging—and why does it matter for quantum computing? pic.twitter.com/H7gUxceb1r

— ConScience (@ConScienceAB) October 15, 2025